imec: New Methods for 2.5D and 3D Integration
By Pat Brans, EETimes Europe (October 29, 2024)
In preparation for ITF SEMICON Europa 2024 in Munich, EE Times Europe sat down with Eric Beyne, senior fellow and 3D program director at imec, to find out more about the new 2.5 and 3D integration approaches imec is preparing for industrial use.
In preparation for ITF SEMICON Europa 2024 in Munich, EE Times Europe sat down with Eric Beyne, senior fellow and 3D program director at imec, to find out more about the new 2.5D and 3D integration approaches imec is preparing for industrial use.
Research in 2.5D and 3D integration is primarily driven by the need to overcome the memory wall, where computing performance is limited by the relatively slow transfer of data between memory units and processing units. This bottleneck is driving efforts to place memory stacks closer to the chip, using different approaches that inevitably require heterogeneous integration of different dies and memory units on silicon interposers.
“We need technologies for lateral interconnect between chips, which we sometimes refer to as 2.5D,” Beyne said. “And we need 3D integration, where you use the full surface of the die to make vertical interconnects, which is more effective when your primary goal is high volume and fast I/O between the chips.”
To read the full article, click here
Related Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Interconnect Chiplet
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- CEA Combines 3D Integration Technologies & Many-Core Architectures to Enable High-Performance Processors That Will Power Exascale Computing
- 2.5D Integration: Big Chip Or Small PCB?
- EV Group Highlights 3D Integration Process Solutions at SEMICON Taiwan 2024
- The Basics of Chiplet Integration and Importance of Adhesive Solutions
Latest News
- AI Pushes High-End Mobile From SoCs To Multi-Die
- Infinitesima Metron®3D 300mm System Released for In-line Process Control by Leading DRAM Manufacturer
- Tenstorrent’s Blue Cheetah deal a harbinger of chiplet acquisition spree
- Tenstorrent Acquires Blue Cheetah Analog Design
- Silicon Box Celebrates Fourth Anniversary with Rapid Growth, New Milestones