ESD Alliance and Silicon Assurance Chiplet Security Webinar Set for March 14
Virtual Event to Highlight Emerging Threats During Chiplet Design, Assembly, Testing
MILPITAS, Calif. –– February 8, 2024 –– A virtual panel discussion webinar on chiplet security hosted by the Electronic System Design Alliance (ESD Alliance), a SEMI Technology Community, and ESD Alliance member Silicon Assurance, will be held Thursday, March 14, from 9 a.m. until 10 a.m.
The free event will identify threats that occur at the different stages of chiplet design, assembly and test, examine the latest advancements in addressing these threats and discuss safeguarding the future of chiplet design technology.
Raj Gautam Dutta, CEO of Silicon Assurance, will moderate. Panelists will be Swarup Bhunia, Semmoto Endowed Professor and Director of the Warren B. Nelms Institute; Steve Carlson, Director/Solutions Architect, Aerospace and Defense Solutions at Cadence Design Systems; John Hallman, Digital Verification Technology Solutions Manager for Siemens EDA; Serge Leef, Head of Secure Microelectronics at Microsoft; Salman Nasir, Senior Technical Program Manager from Battelle; and Ming Zhang, Vice President of R&D Acceleration at PDF Solutions.
Registration for the virtual Chiplet Security—Current and Future webinar is free. Details can be found on the ESD Alliance website.
About the Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. Visit ESD Alliance to learn more.
About SEMI
SEMI® connects more than 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more.
About Silicon Assurance
Silicon Assurance is at the forefront of addressing trust issues by providing security assurance solutions for silicon chips. It helps customers by providing best-in-class technologies with which they can evaluate and protect the chips used in their devices ranging from smartphones to self-driving cars. The unique portfolio of products and expertise provided by Silicon Assurance will enhance the confidence of customers in selling their devices to end-users. Visit Silicon Assurance at: https://siliconassurance.com/.
Related Chiplet
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
- UCIe based 12-bit 12-Gsps Transceiver
Related News
- Silicon Box’s Business Head on how chiplet architecture transforms semiconductor scalability
- Silicon Catalyst at the Chiplet Summit: Presentation, Panel and Exhibition
- Silicon Catalyst at the Chiplet Summit: Presentation, Panel and Exhibition
- Silicon Box breaks bottleneck in chiplet packaging with sub-5-micron technology
Latest News
- CHIPS for America Announces up to $300 million in Funding to Boost U.S. Semiconductor Packaging
- Scintil Photonics names Matt Crowley as CEO, founder Sylvie Menezo will continue heading technology developments and customer partnerships
- TSMC drives A16, 3D process technology
- Eliyan Ports Industry’s Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- GlobalFoundries and U.S. Department of Commerce Announce Award Agreement on CHIPS Act Funding for Essential Chip Manufacturing