Understanding 3DIC, Heterogeneous Integration, SiP, and Chiplets at Once
The semiconductor industry enters the era of integration. Various foundries are focusing on advanced packaging technologies, but the terminology surrounding advanced packaging can be daunting. This article aims to explain these terms in the simplest way possible.
According to a report from TechNews, currently, there are two main trends in advanced packaging: heterogeneous integration and chiplets.
In fact, the concept of “heterogeneous integration” has been developing for many years and is not exclusive to advanced packaging. It is not only used for the integration of heterogeneous chiplets but also for integrating other non-chip active/passive components into a single package, which is the technology commonly used in traditional Outsourced Semiconductor Assembly and Test Services(OSATs).
To read the full article, click here
Related Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Interconnect Chiplet
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- TSMC to Provide 3DIC Integration for AI Chips in 2027, Featuring 12 HBM4 and Chiplets Manufactured with A16
- What Exactly Are Chiplets And Heterogeneous Integration?
- Five workflows for tackling heterogeneous integration of chiplets for 2.5D/3D
- The Era of Heterogeneous Integration Approaches: Who Shall Dominate the Advanced Packaging Field?
Latest News
- Baya Systems Celebrates First Year of Hypergrowth After Emerging from Stealth
- Can You Build A Known-Good Multi-Die System?
- BOS Joins VESA and UCIe to Advance Global Standards in Display and Chiplet Technology
- Arteris Accelerates AI-Driven Silicon Innovation with Expanded Multi-Die Solution
- Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry