Understanding 3DIC, Heterogeneous Integration, SiP, and Chiplets at Once
The semiconductor industry enters the era of integration. Various foundries are focusing on advanced packaging technologies, but the terminology surrounding advanced packaging can be daunting. This article aims to explain these terms in the simplest way possible.
According to a report from TechNews, currently, there are two main trends in advanced packaging: heterogeneous integration and chiplets.
In fact, the concept of “heterogeneous integration” has been developing for many years and is not exclusive to advanced packaging. It is not only used for the integration of heterogeneous chiplets but also for integrating other non-chip active/passive components into a single package, which is the technology commonly used in traditional Outsourced Semiconductor Assembly and Test Services(OSATs).
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- TSMC to Provide 3DIC Integration for AI Chips in 2027, Featuring 12 HBM4 and Chiplets Manufactured with A16
- What Exactly Are Chiplets And Heterogeneous Integration?
- Five workflows for tackling heterogeneous integration of chiplets for 2.5D/3D
- The Era of Heterogeneous Integration Approaches: Who Shall Dominate the Advanced Packaging Field?
Latest News
- Where co-packaged optics (CPO) technology stands in 2026
- Qualcomm Completes Acquisition of Alphawave Semi
- Cadence Tapes Out UCIe IP Solution at 64G Speeds on TSMC N3P Technology
- Avnet ASIC and Bar-Ilan University Launch Innovation Center for Next Generation Chiplets
- SEMIFIVE Strengthens AI ASIC Market Position Through IPO “Targeting Global Markets with Advanced-nodes, Large-Die Designs, and 3D-IC Technologies”