Understanding 3DIC, Heterogeneous Integration, SiP, and Chiplets at Once
The semiconductor industry enters the era of integration. Various foundries are focusing on advanced packaging technologies, but the terminology surrounding advanced packaging can be daunting. This article aims to explain these terms in the simplest way possible.
According to a report from TechNews, currently, there are two main trends in advanced packaging: heterogeneous integration and chiplets.
In fact, the concept of “heterogeneous integration” has been developing for many years and is not exclusive to advanced packaging. It is not only used for the integration of heterogeneous chiplets but also for integrating other non-chip active/passive components into a single package, which is the technology commonly used in traditional Outsourced Semiconductor Assembly and Test Services(OSATs).
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- TSMC to Provide 3DIC Integration for AI Chips in 2027, Featuring 12 HBM4 and Chiplets Manufactured with A16
- What Exactly Are Chiplets And Heterogeneous Integration?
- Five workflows for tackling heterogeneous integration of chiplets for 2.5D/3D
- The Era of Heterogeneous Integration Approaches: Who Shall Dominate the Advanced Packaging Field?
Latest News
- Alphawave Semi Delivers Cutting-Edge UCIe™ Chiplet IP on TSMC 3DFabric® Platform
- EV Group Highlights Hybrid Bonding, Lithography, and Support for U.S. Semiconductor Onshoring at SEMICON West 2025
- HyperLight Introduces 110 GHz Reference IQ Modulators covering optical O, C and L wavelength bands for 240 GBaud Class Applications
- YES Receives Multiple VeroTherm™ and VeroFlex™ System Orders from Leading Memory Supplier
- Rebellions Raises $250 Million to Advance the Next Generation AI Infrastructure, Backed by Arm and Samsung