What Exactly Are Chiplets And Heterogeneous Integration?
New technologies drive new terminology, but the early days for those new approaches can be very confusing.
By Bryon Moyer, SemiEngineering | March 20, 2025
The terms “chiplet” and “heterogeneous integration” fill news pages, conference papers, and marketing presentations, and for the most part engineers understand what they’re reading. But speakers sometimes stumble during a presentation trying to figure out whether a particular die qualifies as a chiplet, and heterogeneous integration comes in different guises for different people. Both terms lack well-accepted definitions that can help navigate the nuances that now bedevil the terms.
For some industry experts, the presence of a die-to-die interface qualifies a piece of silicon as a chiplet. There is much more disagreement when it comes to heterogeneous integration, and when pushing and pulling on different criteria during a discussion, one person’s definition may shift. Today, this discussion could feel pedantic, but in the long term, clear and consistent definitions could spur growth in this nascent architecture.
To read the full article, click here
Related Chiplet
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
Related News
- What are the challenges when testing chiplets?
- Understanding 3DIC, Heterogeneous Integration, SiP, and Chiplets at Once
- 2024 IEEE Electronic Components and Technology Conference to Spotlight Cutting-Edge Microelectronics Packaging Technologies; Photonic Devices, Heterogeneous Integration are Among Key Topics
- Five workflows for tackling heterogeneous integration of chiplets for 2.5D/3D
Latest News
- China Accounts for 56% of Global Optical Module Manufacturing; Short-Term Supply Chain Decoupling Unlikely Under Potential U.S. Restrictions
- Socionext Joins imec's Autonomous Edge Chiplet Program (AECP)
- CEA-Leti Pushes Stacking Roadmap as AI Runs Into Memory and Power Limits
- Department of Commerce Announces Letters of Intent With 7 Companies for $874 Million to Accelerate Semiconductor R&D for the Compute Supply Chain
- Micross to Acquire AEMtec, Significantly Expanding European Footprint in Advanced Packaging and Optoelectronics