What Exactly Are Chiplets And Heterogeneous Integration?
New technologies drive new terminology, but the early days for those new approaches can be very confusing.
By Bryon Moyer, SemiEngineering | March 20, 2025
The terms “chiplet” and “heterogeneous integration” fill news pages, conference papers, and marketing presentations, and for the most part engineers understand what they’re reading. But speakers sometimes stumble during a presentation trying to figure out whether a particular die qualifies as a chiplet, and heterogeneous integration comes in different guises for different people. Both terms lack well-accepted definitions that can help navigate the nuances that now bedevil the terms.
For some industry experts, the presence of a die-to-die interface qualifies a piece of silicon as a chiplet. There is much more disagreement when it comes to heterogeneous integration, and when pushing and pulling on different criteria during a discussion, one person’s definition may shift. Today, this discussion could feel pedantic, but in the long term, clear and consistent definitions could spur growth in this nascent architecture.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- What are the challenges when testing chiplets?
- Understanding 3DIC, Heterogeneous Integration, SiP, and Chiplets at Once
- 2024 IEEE Electronic Components and Technology Conference to Spotlight Cutting-Edge Microelectronics Packaging Technologies; Photonic Devices, Heterogeneous Integration are Among Key Topics
- EV Group Hybrid Bonding, Maskless Lithography and Layer Transfer Solutions for Heterogeneous Integration to be Highlighted at ECTC 2025
Latest News
- Xanadu and Tower Semiconductor Deepen Strategic Collaboration to Accelerate Photonic Quantum Hardware Innovation
- EV Group Unveils Next-Generation EVG®120 Resist Processing System for High-Volume Manufacturing
- CEA Demonstrates First Dynamically Routed Electro-Optical Router for Photonic Interposers
- Renesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era
- Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs