TSMC to Provide 3DIC Integration for AI Chips in 2027, Featuring 12 HBM4 and Chiplets Manufactured with A16
By Trendforce (September 5, 2024)
Jun He, Vice President of Advanced Packaging Technology and Service at TSMC, stated that 3D IC is a crucial method for integrating AI chip memory with logic chips.
According to a report from TechNews, regarding the development of 2.5D CoWoS advanced packaging, which integrates eight chiplets, TSMC will use the A16 advanced process to manufacture the chiplets, and integrated them with 12 HBM4, which is expected to be launched in 2027.
Reportedly, in his speech at the Semicon Taiwan 2024 “3D IC / CoWoS for AI Summit,” He noted that the global semiconductor market is projected to become a trillion-dollar industry by 2030, with HPC and AI being the key drivers, accounting for 40% of the market, which also make AI chips crucial drivers for 3D IC packaging.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies
- AI and Chiplets Prominent at TSMC OIP 2025
- Executive Outlook: Chiplets, 3D-ICs, and AI
- Understanding 3DIC, Heterogeneous Integration, SiP, and Chiplets at Once
Latest News
- Tower Semiconductor Signs Customer Contracts for $1.3 Billion Silicon Photonics Revenue for 2027
- IC-Link by imec joins TSMC 3DFabric® Alliance to accelerate advanced packaging and 3D IC innovation
- EXTOLL announces Availability of Industry's first 16G UCIe PHY IP in GlobalFoundries 22FDX/22FDX+ Ready for Customer Integration
- NHanced Semiconductors & the University of Florida to Present on Hybrid Bonding Reliability at the 2026 Electronic Components & Technology Conference in Orlando
- Wooptix Targets AI Packaging Bottleneck with Astronomy Tech