The Future of Chiplets
With Junko Yoshida, Ron Wilson, David Bennett
At the 2024 Business of Semiconductor Summit, Tenstorrent's Chief Customer Officer, David Bennett, shared insights on the pivotal role of chiplets in the future of AI hardware. He discussed how Tenstorrent is leveraging adaptable and efficient chiplet technology to meet the growing demands of AI applications. Watch this session to find out how Tenstorrent is shaping the future of #AI computing!
Related Chiplet
- Optical Chiplet
- Reverse Gearbox Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
Related Videos
- The UCIe™ 1.1 Specification: Future Applications of Chiplets
- The future of AI: Chiplets & Lasers
- Chiplets for the future of AI
- Electronica 2024 - Shaping the Future of Automotive Electronics with Chiplets and Sustainability
Latest Videos
- The European Chip Ecosystem
- Scaling up AI Compute, Memory and Connectivity
- CURIE: A Cycle-Accurate and Synthesizable UCIe Interface for the Agile Design and Co-Simulation of Chiplets
- Federated Chiplet Design and Simulation
- Custom HBM as a System: Co-designing the Base Die, Die to Die Power, and Package Thermals for AI Accelerators