Scaling 3D IC technologies: from niche to mainstream

As compute demands exponentially increase to power AI-based applications, the urgency for effective chiplet integration solutions has reached an inflection point. Currently, 2.5D and 3D heterogeneous integration technologies remain largely confined to a select group of vertically integrated hyperscaler companies. With mounting scaling challenges and cost pressures across the semiconductor industry, a growing number of companies are evaluating 3D IC architectures as viable alternatives to advanced node monolithic designs. This raises a pivotal question: Is the 3D IC ecosystem prepared to scale from its current limited deployment to a broad, accessible marketplace?

This panel examines the application domains poised to benefit most from 3D IC technologies and identifies the technical, economic, and ecosystem barriers impeding widespread adoption. We assess the actual market demand for chiplet-based solutions and evaluate industry initiatives to establish the standards, interfaces, and best practices necessary for creating an open and thriving chiplet ecosystem.

Moderator:

• Ed Sperling, Semiconductor Engineering

Panelists:

• Jeff Cain, Chipletz
• Letizia Giuliano, Alphawave Semi
• Lalitha Immaneni, Intel
• Subi Kengeri, Applied Materials
• Deepak Kulkarni, AMD
• Tony Mastroianni, Siemens EDA