From Internal Designs to Open Chiplet Economy: Discussion on How to Create Open, Democratized Access to Chiplet Technology
Generally available chiplets in an Open Marketplace promise to speed up semiconductor system design and lower development costs. They can be seen as the best of soft-IP and individually packaged chips, giving you the breadth of specific functionality of IP and the well-defined form factor and known-good parts of the latter. However, there are a plethora of challenges before we can get to this end-state of an open chiplet marketplace that everybody is hoping for, ranging from missing standards to partially unclear value propositions. In this panel, we will discuss these challenges and tabulate progress with a group of experts in the field.
Moderator:
- Raghu Shankar
Panelists:
- Arvind Kumar (Principal Researcher) - IBM Research
- Clint Walker - Alphawave Semi
- Nilesh Shah (Vp Business Development) - Zeropoint Technologies
- Raj Uppala (Sr Director - Marketing & Partnerships) - Rambus
- Jack Guedj (President & Ceo) - Numem
Related Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
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- Advancing the Open Chiplet Economy
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- Standards for Chiplet Design with 3DIC Packaging (Part 1)
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