How to Simulate Chiplets 3x Faster with Xcelium
Chiplet-based designs are powerful, but testing them can be painfully slow. In this whiteboard video, we explain how Cadence’s Xcelium Distributed Simulation App helps engineers run multi-die simulations up to three times faster. Join our Industry expert from Samsung Semiconductor Research India, who breaks down the chiplet complexity into simple vocabulary and helps understand the aspects of multi-die simulations.
Related Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
Related Videos
- How to accelerate innovation in IC technology with chiplets and 3D ICs
- How Chiplets are Helping to Democratize Semiconductor Design with Mohit Gupta, CEO of TYLsemi
- Getting Moore with Less: How Chiplets and Open Interconnect Accelerate Cloud-Optimized AI Silicon
- Unleashing Chiplet potential with BoW - "The Knot That Ties Chiplets Together"
Latest Videos
- From Transistors to AI: The Chiplet Revolution with Ramune Nagisetty
- Scaling AI with Chiplets & CPO
- Open Interconnect Innovations: A Deep Dive into the UALink Chiplet Specification Tutorial
- From chips to silicon destiny: The next wave of 3D IC
- How Chiplets are Helping to Democratize Semiconductor Design with Mohit Gupta, CEO of TYLsemi