Embracing the Chiplet Journey
In his Chiplet Summit keynote, Boyd Phelps, Senior Vice President and General Manager of Cadence's Silicon Solutions Group, talks about how the changeover to chiplets requires advanced tools as well as the challenges that designers, foundries and companies need to address
Related Chiplet
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- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
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