Embracing the Chiplet Journey
In his Chiplet Summit keynote, Boyd Phelps, Senior Vice President and General Manager of Cadence's Silicon Solutions Group, talks about how the changeover to chiplets requires advanced tools as well as the challenges that designers, foundries and companies need to address
Related Chiplet
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
Related Videos
- DreamBig Semiconductor's Journey From Seed to Series B Funding for Their Multi-Die AI Chiplet
- The Rise of the Chiplet
- Unleashing Chiplet potential with BoW - "The Knot That Ties Chiplets Together"
- Charting Architectural Innovation in the Chiplet Era with OCP's Cliff Grossner
Latest Videos
- Driving the Future of Automotive Compute with UCIe
- A Physics-Informed Neural Network Surrogate for Runtime PDN and Dynamic Droop Prediction in 2.5-D Chiplet Integration
- A Chiplet Interface Model for System-Level PPA Exploration
- Zero trust in silicon: The new security imperative for chiplet-based 3D ICs
- Beyond the data pipe: Why connectivity IP is now the system-critical layer in every 3D IC