Chiplet Quilting for the Age of Inference
Join Raja Koduri, the architect behind multiple GPU generations at ATI, Apple, AMD, and Intel. He pioneered 2.5D chiplets with HBM and pushed the limits of 3D stacking with Ponte Vecchio's 47 chiplets in a single package. The age of inference demands chiplets that scale and adapt to rapidly evolving AI algorithms. Raja will reveal the opportunities ahead and showcase the IP Oxmiq Labs is building for the entire ecosystem.
Related Chiplet
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
Related Videos
- The Rise of the Chiplet
- TSMC 3Dblox™: Unleashing 3D IC Innovations for the Next Generation of AI, HPC, Mobile and IoT
- Paving the way for the Chiplet Ecosystem
- Exploring the Advancement of Chiplet Technology and the Ecosystem
Latest Videos
- Zero trust in silicon: The new security imperative for chiplet-based 3D ICs
- Beyond the data pipe: Why connectivity IP is now the system-critical layer in every 3D IC
- An Automated Interconnect Modeling Framework for Rapid Cryptolet Design Space Exploration
- DICE: Detailed Inter-Chiplet End-to-End PHY Modeling for Accurate Chiplet Simulation
- The Evolution Of UCIe