Bunch of Wires Flexi 1.0: a low-cost, low power D2D interface

Morgan Whately, Distinguished Engineer, Infineon Technologies
Kash Johal, CEO, YorChip

BoW Flexi targets systems that benefit from heterogeneous integration but require a simple, low-cost interface between chiplets. A representative use case is a sensor chiplet connected to a microcontroller, where data rates are low (tens of KB-s) and traffic is often asymmetric. Existing die-to-die (D2D) PHY solutions are optimized for high-performance computing, supporting extremely high data rates and dense interconnects, which increases complexity, area, and cost. In contrast, BoW Flexi provides a streamlined D2D interface tailored for lower bandwidth applications, reducing implementation overhead while maintaining efficient latency and power. This makes it well-suited for cost- and energy-constrained edge and embedded systems where simplicity and right-sized performance are critical