Building Interoperable AI Systems with Chiplets Arm Neoverse and Cadence in an Open Ecosystem

Michael Posner, Group Director - Cadence Design Systems
Saif Elsaady, Hardware Ecosystem Manager - Arm

 AI infrastructure is accelerating adoption of modular, chiplet-based architectures that require interoperability and ecosystem alignment. This session highlights joint Arm–Cadence innovation enabling AI-ready silicon using Arm Neoverse platforms integrated with Cadence Design IP (PCIe, UCIe, DDR) within an FCSA-compliant chiplet framework. A shift-left methodology is central—leveraging virtual prototyping alongside emulation to enable early software development and pre-silicon interoperability validation. This reduces integration risk, shortens debug cycles, and accelerates system bring-up. The solution supports scalable, composable architectures across compute, memory, and I-O chiplets, enabling heterogeneous integration. By aligning to open standards and reusable IP, Arm and Cadence demonstrate how ecosystem-driven collaboration improves silicon readiness, ensures interoperability, and drives adoption for next-generation AI and datacenter platforms.