All About Optical Interconnects
Terry Thorn, vice president commercial operations at optical interconnect solutions developer Ayar Labs, discusses the ever-evolving road to overcoming AI system bottlenecks, and how optical solutions are poised to provide answers. Industry-specific challenges, plus Ayar’s own innovations, are spotlighted in this interview.
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related Videos
- Proximity is all You Need – Two Tricks for Chiplet Interconnects
- Intel's Optical I/O Chiplet Co-Packaged with Server CPU
- Intel Demonstrates First Fully Integrated Optical I/O Chiplet for More Scalable AI
- Photonic Fabric Interface Chiplets for AI XPU Optical Connectivity
Latest Videos
- 2026 Predictions from Alpahwave Semi, now part of Qualcomm
- Arm Viewpoints: Chiplets explained – the technology and economics behind the next wave of silicon innovation
- The State of Multi-Die: Insights and Customer Requirements
- Coding approaches for increasing reliability and energy efficiency of 3D technologies
- AI-Driven Thermal Prediction for Enhanced Reliability in 3D HBM Chiplets