Advanced CPO Integrated by CoWoS and COUPE
By Dr. Shang Y. Hou
Director, High Performance Packaging Integration
TSMC
CoWoS is widely used for high performance network switch and AI accelerators. This talk will explore the rationale behind advanced Co-packaged Optics (CPO) based on CoWoS and COUPE, highlighting how these innovations are driving high-bandwidth, energy-efficient data connectivity. I will discuss the current development status, share insights into technical challenges, and provide a forward-looking perspective on future advancements in CPO packaging technology.
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