This Chinese city wants to be the Silicon Valley of chiplets
By Zeyi Yang, MIT Technology Review (February 7, 2024)
Wuxi, the Chinese center of chip packaging, is investing in chiplet research to enhance its role in the semiconductor industry.
Outside China, chiplets are one of the alternative routes that the semiconductor industry could take to improve chip performance cost-effectively. Instead of endlessly trying to cram more transistors into one chip, the chiplet approach proposes that the functions of a chip can be separated into several smaller devices, and each component could be easier to make than a powerful single-piece chip. Companies like Apple and Intel have already made commercial products this way.
But within China, the technology takes on a different level of significance. US sanctions mean that Chinese companies can’t purchase the most advanced chips or the equipment to make them, so they have to figure out how to maximize the technologies they have. And chiplets come in handy here: if the companies can make each chiplet to the most advanced level they are capable of and assemble these chiplets into a system, it can act as a substitute for more powerful cutting-edge chips.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana
- Advanced packaging blurs line between monolithic chip and packaged assembly of heterogeneous chips: NAPMP NoI
- Biden-Harris Administration Announces CHIPS Incentives Awards with Absolics and Entegris to Support Development of Advanced Packaging Technology and Onshore Materials for Leading-Edge Chip Production
- GlobalFoundries Announces New York Advanced Packaging and Photonics Center
Latest News
- AI Processors Shift to System-Level Design with Alchip’s 3DIC Platform
- JCET Achieves Performance Breakthrough in Glass-Based TGV RF IPDs, Paving the Way for 5G and 6G Applications
- Baya Systems Strengthens Engineering Leadership to Accelerate Chiplet Implementation
- Onto Innovation’s Dragonfly® G5 System Qualified for Applications in 2.5D AI Packaging
- Indium Corporation Presents Collaborative Research on Solder Alloy Reliability for Heterogeneous Integration at ICEP-HBS