This Chinese city wants to be the Silicon Valley of chiplets
By Zeyi Yang, MIT Technology Review (February 7, 2024)
Wuxi, the Chinese center of chip packaging, is investing in chiplet research to enhance its role in the semiconductor industry.
Outside China, chiplets are one of the alternative routes that the semiconductor industry could take to improve chip performance cost-effectively. Instead of endlessly trying to cram more transistors into one chip, the chiplet approach proposes that the functions of a chip can be separated into several smaller devices, and each component could be easier to make than a powerful single-piece chip. Companies like Apple and Intel have already made commercial products this way.
But within China, the technology takes on a different level of significance. US sanctions mean that Chinese companies can’t purchase the most advanced chips or the equipment to make them, so they have to figure out how to maximize the technologies they have. And chiplets come in handy here: if the companies can make each chiplet to the most advanced level they are capable of and assemble these chiplets into a system, it can act as a substitute for more powerful cutting-edge chips.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- Advanced packaging blurs line between monolithic chip and packaged assembly of heterogeneous chips: NAPMP NoI
- Biden-Harris Administration Announces CHIPS Incentives Awards with Absolics and Entegris to Support Development of Advanced Packaging Technology and Onshore Materials for Leading-Edge Chip Production
- GlobalFoundries Announces New York Advanced Packaging and Photonics Center
- ERS electronic Unveils Production, R&D Facility, and Competence Center for Advanced Packaging in Germany
Latest News
- Tower Semiconductor Signs Customer Contracts for $1.3 Billion Silicon Photonics Revenue for 2027
- IC-Link by imec joins TSMC 3DFabric® Alliance to accelerate advanced packaging and 3D IC innovation
- EXTOLL announces Availability of Industry's first 16G UCIe PHY IP in GlobalFoundries 22FDX/22FDX+ Ready for Customer Integration
- NHanced Semiconductors & the University of Florida to Present on Hybrid Bonding Reliability at the 2026 Electronic Components & Technology Conference in Orlando
- Wooptix Targets AI Packaging Bottleneck with Astronomy Tech