Advanced packaging blurs line between monolithic chip and packaged assembly of heterogeneous chips: NAPMP NoI

By Pradeep Chakraborty, Pradeep’s TechPoints (July 17, 2024)

Dr. Subramanian S. Iyer, Senior Technical Advisor, CHIPS NAPMP, recently provided the notice of intent (NoI).

National Advanced Packaging Manufacturing Program (NAPMP) will drive US leadership in advanced packaging and provide the technology needed for packaging manufacturing in the United States. NAPMP will develop critical and relevant innovations for advanced packaging technologies and accelerate their scaled transition to US manufacturing entities.

Within a decade, NAPMP-funded activities, coupled with CHIPS manufacturing incentives, will establish a vibrant, self-sustaining, profitable, high-volume, domestic, advanced packaging industry where advanced-node chips manufactured in the U.S. are packaged in the U.S. We expect the technology developed to be leveraged in new applications and market sectors and at scale.

Packaging roadmaps include NIST-sponsored roadmaps such as MRHIEP, MAESTRO, and MAPT. Other roadmaps include HIR and IRDS. All aspects of technologies are required to develop leading-edge onshore advanced packaging manufacturing capability.

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