ERS electronic Unveils Production, R&D Facility, and Competence Center for Advanced Packaging in Germany
February 6, 2025 -- Today, ERS electronic, the industry leader of thermal management solutions for semiconductor manufacturing, celebrated the official opening of ERS Barbing, its new state-of-the-art production and R&D facility, coupled with a cutting-edge Competence Center for Advanced Packaging and Advanced Backend technologies. This strategic expansion marks a significant milestone in ERS’s commitment to bolstering the European semiconductor ecosystem and fostering industry collaboration.
Located in Barbing near Regensburg, this new facility is designed to accelerate process development and production of ERS’s renowned Advanced Packaging equipment. Additionally, the integrated Competence Center offers customers direct access to ERS’s extensive technical expertise in wafer and panel debonding, as well as warpage handling and measurement, enabling hands-on testing, demonstrations, and collaborative innovation.
“The opening of this facility underscores our dedication to advancing semiconductor technologies and supporting our customers in Europe and beyond,” says Laurent Giai-Miniet, CEO of ERS electronic. “Through firsthand demonstrations and personalized support, we aim to help our customers accelerate time-to-market and optimize manufacturing processes.”
Imre Kosa, Site Manager of ERS Barbing, adds, “By combining production, R&D, and a Competence Center under one roof, we are empowering our partners with the tools and knowledge needed to drive innovation and meet the growing demands of the industry. We invite our partners and customers to visit and discover how our capabilities can help them overcome process challenges in debonding and warpage management.”
By investing in this facility, ERS reinforces its role as a key contributor to the European semiconductor industry, aligning with regional initiatives to strengthen competitiveness and boost supply chain resilience.
To schedule a visit or learn more about the capabilities of the Competence Center, interested parties can contact ERS regional sales representatives or submit a visit request on the ERS website.
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- Two big reliability problems in advanced packaging
- 2024 IEEE Electronic Components and Technology Conference to Spotlight Cutting-Edge Microelectronics Packaging Technologies; Photonic Devices, Heterogeneous Integration are Among Key Topics
- Biden-Harris Administration Announces Preliminary Terms with Absolics to Support Development of Glass Substrate Technology for Semiconductor Advanced Packaging
- SCHMID Group Takes Next Step Towards Advanced Packaging for Integrated Circuits with Glass Cores
Latest News
- NLM Photonics and Spark Photonics Partner to Advance Organic Hybrid Solutions
- Marvell Announces Acquisition of Polariton Technologies, Advancing Optical Performance Scaling to 3.2T and Beyond
- Alchip to Showcase Advanced AI ASIC Technologies at TSMC 2026 Technology Symposium
- CEZAMAT Boosts Advanced Photonics R&D with State-of-the-Art UV Nanoimprint System from EV Group
- Pat Gelsinger joins Syenta's board as Playground Global and NRF lead A$37M raise