What are the challenges when testing chiplets?
By Jeff Shepard, Microcontroller Tips (March 4, 2024)
Chiplet testing begins with performance simulations during the design process. Compared with monolithic devices, heterogeneous chiplets require more complex testing, including known good die (KGD) testing, final test, and system level test. Success also depends on the implementation of design for test (DfT) based on several IEEE standards.
Chiplet designers need high-speed tools that can quickly and precisely simulate the die-to-die (D2D) interconnects, which are one of the keys to chiplet performance. For an increasing number of chiplets, simulation, and verification that the design meets the specifications of the Universal Chiplet Interconnect Express (UCIe) standard is another key consideration.
To read the full article, click here
Related Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
Related News
- ASIC platform targets automotive chiplets
- Can Chiplets Solve Semiconductor Challenges?
- Proprietary Vs. Commercial Chiplets
- Axelera plans AI chiplets for automotive
Latest News
- Arteris Accelerates Industry Transition to Multi-Die Chiplet-Based Architecture
- Fujitsu launches made-in-Japan next-generation CPU FUJITSU-MONAKA and Fujitsu MONAKA Server for sovereign AI infrastructure
- Signaloid joins Open Chiplet Atlas Alliance and Announces Plans to Make Its UxHw ASICs Available via OCA Ecosystem
- Lorentz Solution Jointly Presents with NVIDIA on Automated Large-Scale Chip-Level 3D EM Extraction and Sign-off of Ultra-High-Speed Silicon Photonics and IC/3DIC Designs at 2026 TSMC OIP
- Alchip Technologies Showcases Advanced ASIC Design and Packaging at AI Infra Summit 2026