Brewer Science to Present Temporary Bonding Materials for Chiplet Integration at 2025 Critical Materials Council (CMC) Conference
Austin, TX– April 4, 2025 – Brewer Science, Inc., a global leader in advanced packaging materials for the semiconductor industry, is pleased to announce that Dr. Andrea Chacko, Director of Packaging Solutions R&D, will present at the 2025 Critical Materials Council (CMC) Conference in Austin, Texas.
Dr. Chacko will deliver a technical presentation titled “Temporary Bonding Materials for Chiplet Integration” on April 10th at 10:20 AM, highlighting Brewer Science’s latest advancements in enabling the next generation of semiconductor packaging.
Heterogeneous integration and ultrathin dies rely on optimized TBDB processes
As the semiconductor industry moves toward heterogeneous integration and advanced chiplet-based architectures, the ability to handle ultrathin dies presents significant manufacturing challenges. Brewer Science’s BrewerBOND® VersaLayer System materials are designed to optimize temporary bonding and debonding (TBDB) processes, offering a reliable, scalable, and cost-effective solution for thin die handling, wafer thinning, and advanced packaging applications such as die-to-wafer (D2W) hybrid bonding and fan-out wafer-level packaging (FOWLP).
Dr. Chacko will discuss how Brewer Science’s innovative bonding process minimizes process steps, reduces die warpage, and enhances throughput for advanced semiconductor packaging.
For more information, visit www.brewerscience.com or connect with us at the conference.
About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique quality monitoring systems for water and air applications. We are Certified Employee-Owned and a Certified B Corporation™, using our business as a force for good. Our headquarters are in Rolla, Missouri, with customer support throughout the world. Learn more at: www.brewerscience.com.
Related Chiplet
- Optical Chiplet
- Reverse Gearbox Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
Related News
- EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
- EV Group Highlights Hybrid Bonding, Layer Transfer and Maskless Lithography Technologies for Heterogeneous Integration and Advanced Packaging at ECTC 2026
- Imec unlocks system-level III-V chiplet integration on Si-CMOS by advancing its 300mm RF silicon interposer platform with high-density MIMCAPs, passive modeling, and laser-assisted bonding
- EV Group Highlights Hybrid Bonding, Layer Transfer and Lithography Technologies for Heterogeneous Integration and Device Scaling at SEMICON West 2026
Latest News
- ACM Research Announces Shipment of Its First 310 × 310 mm Ultra ECP ap-p Panel-Level Horizontal Electroplating Production Tool
- Entegris Enters Silicon Carbide and Diamond-Enabled Thermal Management Materials Market for AI Advanced Packaging
- Fraunhofer IPMS Showcases New Technologies for the Future of Semiconductor Industry
- Marvell and Lumentum to Combine, Creating a Category Leader in AI Connectivity
- Silicon Austria Labs Adopts PulseForge Photonic Debonding Technology to Accelerate Advanced Packaging and Heterogeneous Integration Research