One Chip Vs. Many Chiplets
Challenges and options vary widely depending on markets, workloads, and economics.
By Ed Sperling, SemiEngineering (November 20th, 2024)
Semiconductor Engineering sat down to discuss the growing list of challenges at advanced nodes and in advanced packages, with Jamie Schaeffer, vice president of product management at GlobalFoundries; Dechao Guo, director of advanced logic technology R&D at IBM; Dave Thompson, vice president at Intel; Mustafa Badaroglu, principal engineer at Qualcomm; and Thomas Ponnuswamy, managing director at Lam Research. This discussion was held in front of a live audience at SEMICON West.
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