Geometry Challenges in Multidie Thermal Management

By Emily Newton, EETimes | December 4, 2025

Three-dimensional, stacked semiconductor architectures create unique geometric challenges for multidie assembly, especially in managing heat. Designers must anticipate how geometry affects thermal distribution and proactively address these obstacles for successful designs.

Heat buildup causes localized hot spots

Some designers wrongly assume a die’s power use is uniform. In reality, it varies greatly, creating areas of intense, localized heat.

Relatedly, the design constraints of a three-dimensional stack largely prevent heat from traveling sideways. Instead, it usually rises, potentially transferring the heat to the dies above it. The geometrical designs of multidie assemblies also result in these products having larger horizontal dimensions than vertical ones, which can further complicate the heat buildup.

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