Multi-Die Design Complicates Data Management
Design data and metadata are ballooning, and no one is quite sure how long to save it or what to delete.
By Adam Kovac, Semi Engineering
February 27th, 2025
The continued unbundling of SoCs into multi-die packages is increasing the complexity of those designs and the amount of design data that needs to be managed, stored, sorted, and analyzed.
Simulations and test runs are generating increasing amounts of information. That raises questions about which data needs to be saved and for how long. During the design process, engineers now must wrestle with the data and metadata of each individual chiplet, the interconnects, the package, and the overall system. This can include multiple substrates, interposers, and non-electrical elements.
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