Arm: Chiplets Can’t Deliver on TCO Without an Ecosystem
By Sally Ward-Foxton, EETimes | June 27, 2025

SAN FRANCISCO, Calif. – Addressing the crowd at EE Times’ The Future of Chiplets event at DAC, Arm’s Eddie Ramirez called on the industry to adopt robust standards and build a true chiplet marketplace, warning that current semi-custom approaches could limit the economic viability of disaggregated SoCs.
“We’ve come very far in the last five years,” Ramirez said, noting that most data center SoCs coming out today are chiplet-based, albeit, they are semi-custom designs where a single vendor designs all of the chiplets.
“That model is great, but it’s hard for that model to have a positive [total cost of ownership, TCO] return because what you’ve now done is increase the overall cost of the SoC design,” he said. “You’re paying for multiple chiplets. You’re qualifying multiple chiplets.”
Arm nevertheless sees progress in chiplet reuse, he said. Companies are emerging that specialise in IO chiplets to allow others to focus on compute or accelerator chiplets.
To read the full article, click here
Related Chiplet
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
Related News
- Arm Total Design Ignites Growing Ecosystem of Arm-based Silicon for a Sustainable AI Datacenter
- Alphawave Semi Elevates Chiplet-Powered Silicon Platforms for AI Compute through Arm Total Design
- Alphawave Semi and Arm to Present on Chiplets for Architecting Next-Generation Terabit AI Networks at the TSMC OIP Ecosystem Forum North America
- Arm Aims to Democratize Chiplets
Latest News
- Allegro DVT Plays a Pivotal Role in Groundbreaking CHASSIS Automotive Base Die Development
- CEO Interview: Rebellions’ NPU Leverages Memory-Centric Chiplets
- Applied Materials Introduces New Systems to Accelerate DRAM and Advanced Packaging for AI Chips
- Quantum Computing Inc. Completes Acquisition of NHanced Semiconductors, Inc.
- GlobalFoundries qualifies SLATE™ advanced packaging technology on 9SW platform for next-generation radio frequency applications