The Chiplet Revolution
Transforming the semiconductor landscape and creating unprecedented opportunities for microchip users
The semiconductor industry is standing at the edge of a profound transformation, thanks to the advent of a game-changing technology: chiplets.
Throughout its history, the semiconductor industry has pursued relentless integration and miniaturization. However, the escalating costs and complexities associated with cutting-edge Integrated Circuits (ICs) on advanced semiconductor technology have led to a revolutionary alternative approach: chiplets.
Most contemporary chips are designed as a monolithic SoC (System-on-Chip), integrating all essential functions—such as the processor cores, domain-specific hardware accelerator, memory, and interfaces — into a monolithic die, ie everything is built into an integrated circuit on a single piece of semiconductor.
Chiplets are a game-changer. They consist of a self-contained semiconductor die that, when combined with other dies through advanced packaging techniques, forms a complex integrated circuit similar to a monolithic integrated circuit. This modular approach enhances scalability, cost-efficiency, and performance. It also enables the integration of diverse functions, such as general-purpose processing, domain-specific processing, and memory into a single system, overcoming some limitations of traditional monolithic designs.
To read the full article, click here
Related Chiplet
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
- UCIe based 12-bit 12-Gsps Transceiver
Related Blogs
- UCIe and Automotive Electronics: Pioneering the Chiplet Revolution
- Silicon Creations is Enabling the Chiplet Revolution
- The Chiplet Revolution
- The Future of Chiplet Reliability