Chiplet Ecosystem - Advanced Packaging

Headquartered in Nijmegen, the Netherlands, ITEC is a back-end semiconductor equipment manufacturer specializing in high-volume production of semiconductors. ITEC provides the highest productivity assembly,...

Absolics is a leading provider of advanced packaging technologies and services, offering scalable solutions for businesses of high-performance computing. We offer smart, innovative services to dozens...

SK hynix Inc., headquartered in Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), flash memory chips (“NAND flash”) and...

ASE is a primary architect of Heterogeneous Integration (HI) - the technology that integrates separately manufactured components into a higher level assembly (System-in-Package or SiP) that in the aggregate...

Adeia is a leading R&D and intellectual property (IP) licensing company that accelerates the adoption of innovative technologies in the media and semiconductor industries. Adeia’s fundamental...

Founded in 2011, Sarcina Technology is the Application Specific Advanced Packaging Service that provides a boutique collaborative experience for small-to-mid-sized IC companies.  It brings a proven...

Deca is the leading independent provider of advanced packaging technology to the semiconductor industry. Our M-Series™ technology is the industry’s highest volume fan-out, powering the world’s...

Silicon Box is an advanced semiconductor integration service provider, specialising in cutting-edge integration technology. We are capable of delivering full execution, from initial design to final manufacturing...

Chipletz, incorporated in 2021, offers Smart Substrate™ products, an advanced packaging technology that addresses the increasing demand for compute performance as Moore's Law slows down. Targeting...