Advanced Semiconductor Engineering, Inc. (ASE) - Chiplet Ecosystem
ASE is a primary architect of Heterogeneous Integration (HI) - the technology that integrates separately manufactured components into a higher level assembly (System-in-Package or SiP) that in the aggregate provides enhanced functionality and improved operational characteristics.
HI is now the key technology in the advancement of integrated systems for greater intelligence and connectivity, higher bandwidth and performance, and lower latency and power per function, all at a more manageable cost. To learn more about ASE Heterogeneous Integration click here and SiP click here.
Market shifts in customer requirements as well as the advent of 5G wireless technologies have given rise to smart manufacturing and the acceleration of Industry 4.0 at ASE. Smart Factories represent the future of our industry and are an integral part of ASE’s business operations. Our strategy is to leverage on AI, Big Data and Smart Automation to achieve full digital transformation. We are moving ahead of our time by harnessing the power of smart manufacturing to increase productivity, add more value to the supply chain and strive for near perfection.
VIPack™
ASE has introduced VIPack™, an advanced packaging platform designed to enable vertically integrated package solutions. VIPack™ represents ASE’s next generation of 3D heterogeneous integration architecture that extends design rules and achieves ultra-high density and performance. The platform leverages advanced redistribution layer (RDL) processes, embedded integration, and 2.5D and 3D technologies to help customers achieve unprecedented innovation when integrating multiple chips within a single package.
As our world navigates the data centric era, the semiconductor market is growing exponentially, with the growth behind the data coming from devices used across Artificial Intelligence (AI), Machine Learning (ML), 5G Communications, High Performance Computing (HPC), Internet-of-Things (IoT), and Automotive applications. Demand for innovative package and IC co-design, cutting-edge wafer level fabrication processes, sophisticated packaging technologies, and comprehensive product and testing solutions has never been greater. The role of packaging has become increasingly critical, as applications call for solutions to enable higher performance, greater functionality, and improved power, while meeting stringent cost parameters. The rising adoption of chiplet-based co-designs is further fueling demand for multi-chip integration into a single package. The launch of VIPack™ firmly establishes a collaborative platform for exceptional interconnect solutions where 3D heterogeneous integration has become critical.
