Henkel - Chiplet Ecosystem

Packaging is a crucial determinant of power, performance and cost. New packaging requirements--thinner wafers, smaller footprints, package integration, 3D designs and wafer-level technology--deliver higher performing microelectronics. Cutting-edge materials enable wirebond and advanced semiconductor packaging applications.

Automotive, communications, and data centers demand more performance from semiconductor technology. As size decreases, performance must increase. Henkel materials are helping elevate semiconductor packaging to meet these needs.