Silicon Photonics and Co-Packaged Optics Shine a Light at OFC 2025
By Nitin Dahad, EETimes | April 4, 2025
The 2025 Optical Fiber Communications Conference, or OFC 2025, took place this week in San Francisco, Calif., amid the excitement of optical networking being one part of the solution to solving the many facets of AI compute bottlenecks.
One this is clear: silicon photonics and co-packaged optics have reached an inflection point, especially more so following Jensen Huang’s enthusiasm for silicon photonics during his keynote at Nvidia’s GTC 2025 a few weeks earlier about 50 miles down south from the OFC 2025 venue at Moscone.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- OFC 2025: Scintil Photonics showcases LEAF Light™, world’s first single-chip, multi-wavelength laser source for DWDM co-packaged optics in AI datacenters
- RANOVUS delivers industry’s first 6.4Tbps Co-Packaged Optics with integrated laser for AI/ML application at OFC 2024
- MediaTek launches next-generation ASIC design platform with co-packaged optics solutions at OFC 2024
- Marvell Demonstrates Industry’s First 200G 3D Silicon Photonics Engine to Scale Accelerated Infrastructure
Latest News
- Omni Design Technologies Advances 200G-Class Co-Packaged Optics IP Portfolio for Next-Generation AI Infrastructure
- Tower Semiconductor Teams with NVIDIA to Advance AI Infrastructure with 1.6T Data Center Optical Modules
- Chiplets Reach an Architectural Turning Point – Menta at Chiplet Summit 2026
- EV Group Highlights Hybrid and Fusion Bonding, Layer Transfer and Maskless Lithography Technologies for Advanced Semiconductor Memory and Packaging at SEMICON Korea 2026
- Lam Research and CEA-Leti Expand Research and Development Collaboration to Advance Fabrication of Specialty Technologies