Athos Scraps Multi-Vendor Roadmap, Plans Chiplet Tape-Out

By Sally Ward-Foxton, EE Times | April 30, 2026

SANTA CLARA, Calif. — Six months after officially spinning out of Mercedes-Benz, functional safety chiplet startup Athos Silicon has redrawn its technology roadmap and will now rely on a purpose-built, in-house-designed chiplet, the company’s founders told EE Times in a recent interview.

The Athos team had been studying chip design for functional safety in autonomous driving for five years as part of Mercedes-Benz, and had spun out Athos with substantial IP at the end of 2024. The process was officially completed in October 2025. The plan had been a multi-chiplet SoC designed for functional safety with three compute SoC dies from a third-party supplier, DreamBig’s chiplet hub in the center, plus an NPU die from another third-party supplier.

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