imec and Brewer Science to Co-Present Breakthroughs in Thin Interposer Assembly and Flash-Lamp Debonding at EPTC 2025

Singapore — November 25, 2025 — Brewer Science, Inc., a global leader in advanced packaging materials and processes, will co‑present two technical papers with imec at the IEEE Electronics Packaging Technology Conference (EPTC) in Singapore, December 2–5, 2025.

Building on last year’s momentum in hybrid bonding and laser debonding, Brewer Science’s 2025 contributions focus on enabling reliable die‑to‑wafer integration on thin interposers and exploring flash‑lamp annealing (FLA) as a high-throughput, cost-effective alternative to excimer‑laser debonding—two advances that help fabs scale heterogeneous integration with better yield, throughput, and process flexibility.

Direct Die‑To‑Wafer Bonding On Thin Interposers: Wafer Reconstruction and Backside Nano‑Topography Evaluation

Presentation demonstrates a sequential dD2W assembly on thinned interposers using Brewer Science’s VersaLayer™ temporary bonding system (including BrewerBOND^® C1301‑50 temporary bonding material (TBM) and BrewerBOND^® T1107 release layer material), followed by over-molding and die‑reveal. The work highlights how embedded Cu pillars can induce backside nano-topography during thinning and outlines process considerations (planarization, TTV control) for high-performance and yield-oriented applications.

Flash Lamp Annealing for Wafer Debonding

Investigates FLA as a debonding route using visible‑light‑absorbing release layers (e.g., engineered metal and insulating stacks) to maximize effective debond fluence. The study identifies the thermal pathways that govern debond success and compares thermoplastic versus thermoset TBMs, charting a path to a novel debond strategy compatible with thin‑wafer handling.

“Heterogeneous integration rises and falls on materials that can tolerate aggressive process windows without sacrificing performance,” said Alice Guerrero, Principal Applications Engineer at Brewer Science and co‑author on both papers. “These results show how our VersaLayer™ temporary bonding system and flash-lamp debonding insights can unlock new integration schemes.”

EPTC is the IEEE Electronics Packaging Society’s flagship conference in the Asia‑Pacific region, convening global experts in advanced packaging, assembly, reliability, and heterogeneous integration. The 2025 conference runs December 2–5, 2025 at Resorts World Sentosa, Singapore. Program details and updates are available on the EPTC website.

About Brewer Science

Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique quality monitoring systems for water and air applications. We are Certified Employee-Owned and a Certified B Corporation™, using our business as a force for good. Our headquarters are in Rolla, Missouri, with customer support throughout the world. Learn more at: www.brewerscience.com.