ITF World 2025: Imec’s Vision for Automotive Over the Long Haul
At this week’s Imec Technology Forum (ITF) 2025, EE Times Europe caught up with imec’s Bart Placklé about how the research institute is helping to reimagine computing architectures for next-generation vehicles.
By Pat Brans, EETimes Europe | May 23, 2025
Modern vehicles are fast becoming data centers on wheels, expected to deliver not just mobility but also autonomy, safety, and a continuous stream of software updates. These expectations come with an insatiable demand for high-performance computing—but in a radically different operating environment from data centers or smartphones. Systems must operate reliably over the vehicle’s 10- to 15-year lifespan, in harsh conditions where heat, vibration, and 24/7 uptime are the norm.
That’s where imec comes in. The Belgian research institute is applying decades of semiconductor innovation to one of the automotive industry’s most pressing challenges: how to design vehicle computing platforms that are powerful, cost-effective, and robust over time. “A car is going to be the most high-end compute device you own,” Bart Placklé, vice president of automotive at imec, told EE Times Europe at this week’s ITF World 2025 in Antwerp, Belgium. “But it’s not in a temperature-controlled server room; it’s out on the road. And once higher levels of autonomy enable a shift away from the current ownership model, the systems will be running virtually nonstop.”
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- TIER IV joins imec’s Automotive Chiplet Program to accelerate chiplet-based architectures and AI accelerators for SDVs
- DreamBig World Leading "MARS" Open Chiplet Platform Enables Scaling of Next Generation Large Language Model (LLM), Generative AI, and Automotive Semiconductor Solutions
- TSMC plans automotive chiplet process for 2025
- Arm, ASE, BMW Group, Bosch, Cadence, Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo commit to join imec’s Automotive Chiplet Program
Latest News
- CEA-Leti, CEA-List and PSMC Collaborate to Integrate RISC-V and MicroLED Silicon Photonics into 3D Stacking and Interposer for Next-Generation AI
- NIST Researchers Develop Photonic Chip Packaging That Can Withstand Extreme Environments
- Rebellions Closes $400 Million Pre-IPO and Launches RebelRack™ and RebelPOD™ to Accelerate Global Expansion
- EdgeCortix Looks To Chiplets For Third-Gen Reconfigurable AI Chip
- Agileo Automation Launches Agil'EDA to Accelerate SEMI EDA Adoption for Semiconductor Equipment OEMs