Commercial Chiplet Ecosystem May Be A Decade Away
By Ann Mutschler, SemiEngineering (February 29, 2024)
Technology and business hurdles must be addressed before widespread adoption.
Experts at the Table: Semiconductor Engineering sat down to talk about the challenges of establishing a commercial chiplet ecosystem with Frank Schirrmeister, vice president solutions and business development at Arteris; Mayank Bhatnagar, product marketing director in the Silicon Solutions Group at Cadence; Paul Karazuba, vice president of marketing at Expedera; Stephen Slater, EDA product management/integrating manager at Keysight; Kevin Rinebold, account technology manager for advanced packaging solutions at Siemens EDA; and Mick Posner, vice president of product management for high-performance computing IP solutions at Synopsys. What follows are excerpts of that discussion.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- AMI Brings Firmware Expertise to Arm Total Design Ecosystem to Simplify and Accelerate Development for Arm-based Custom Chiplet Solutions
- Arm’s Chiplet System Architecture eyes ecosystem sweet spot
- Automotive Chiplet Ecosystem Heralds Agility and Flexibility
- Chiplet Ecosystem Slowly Emerges
Latest News
- CoAsia SEMI Commences Supply of 3D IC SoCs: Korea’s First Case, Positioning 3D IC as the Next HBM
- Eliyan Secures $50 Million in Strategic Investments from Leading Hyperscalers and AI Infrastructure Providers to Accelerate Scalable AI Systems
- Veeco and imec develop 300mm compatible process to enable integration of barium titanate on silicon photonics
- Lightmatter Introduces Guide Light Engine for AI, Featuring VLSP Technology
- Lightmatter and GUC Partner to Produce Co-Packaged Optics (CPO) Solutions for AI Hyperscalers