Commercial Chiplet Ecosystem May Be A Decade Away
By Ann Mutschler, SemiEngineering (February 29, 2024)
Technology and business hurdles must be addressed before widespread adoption.
Experts at the Table: Semiconductor Engineering sat down to talk about the challenges of establishing a commercial chiplet ecosystem with Frank Schirrmeister, vice president solutions and business development at Arteris; Mayank Bhatnagar, product marketing director in the Silicon Solutions Group at Cadence; Paul Karazuba, vice president of marketing at Expedera; Stephen Slater, EDA product management/integrating manager at Keysight; Kevin Rinebold, account technology manager for advanced packaging solutions at Siemens EDA; and Mick Posner, vice president of product management for high-performance computing IP solutions at Synopsys. What follows are excerpts of that discussion.
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- REBEL™ and Beyond — Towards a Unified Chiplet Ecosystem
- AMI Brings Firmware Expertise to Arm Total Design Ecosystem to Simplify and Accelerate Development for Arm-based Custom Chiplet Solutions
- Arm’s Chiplet System Architecture eyes ecosystem sweet spot
- Automotive Chiplet Ecosystem Heralds Agility and Flexibility
Latest News
- Imec mitigates thermal bottleneck in 3D HBM-on-GPU architectures using a system-technology co-optimization approach
- UMC Licenses imec’s iSiPP300 Technology to Extend Silicon Photonics Capabilities for Next-Generation Connectivity
- Geometry Challenges in Multidie Thermal Management
- SCHMID Announces Successful Delivery and Installation of its InfinityLine C+ System to a Leading Japanese Advanced Packaging Customer
- Marvell to Acquire Celestial AI, Accelerating Scale-up Connectivity for Next-Generation Data Centers