Arm’s Chiplet System Architecture eyes ecosystem sweet spot
By Majeed Ahmad, EDN (January 27, 2025)

Arm has announced the availability of the first public specification drafted around its Chiplet System Architecture (CSA), a set of system partitioning and chiplet connectivity standards harnessed in a design ecosystem supported by over 60 companies. The companies that are part of the CSA initiative include ADTechnology, Alphawave Semi, AMI, Cadence, Jaguar Micro, Kalray, Rebellions, Siemens, and Synopsys.
CSA aims to offer industry-wide standards and frameworks by facilitating the reuse of specialized chiplets, and thus address the fragmentation caused by compatibility issues in chiplet design. It provides a shared understanding of defining and connecting chiplets while developing composable system-on-chips (SoCs).
A couple of recent announcements show how semiconductor firms are employing CSA to build chiplets as part of Arm Total Design, a platform for deploying chiplet-based compute subsystems. Arm Total Design facilitates custom silicon solutions powered by Arm Neoverse Compute Subsystems (CSS), which includes processor cores, IPs, software, and design tools.
To read the full article, click here
Related Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
Related News
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon
- Eliyan joins Arm Total Design ecosystem to accelerate chiplet economy
- Cadence Collaborates with Arm to Jumpstart the Automotive Chiplet Ecosystem
- Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market
Latest News
- Applied Materials and Besi Expand Strategic Partnership to Advance Next-Generation Packaging for AI Scaling
- ficonTEC & HTSI Announce Strategic Cooperation to Scale Advanced CPO Test Solutions in Taiwan
- SignatureIP Unveils IP Library for Chiplet-based AI, HPC and Data Center Systems
- AI Drives Larger, Denser Packaging, Raising New Challenges for Equipment Makers
- Hamamatsu Photonics develops inverted emission microscope "iPHEMOS®-DDX" for failure analysis of advanced semiconductor packages