Chiplet Ecosystem Slowly Emerges
Before the transition can be made from custom chiplet environments to a standardized off-the-shelf open marketplace, an ecosystem must be created.
By Brian Bailey, Semi Engineering | July 23rd, 2025
Semiconductor Engineering sat down to discuss progress and remaining challenges for designing with chiplets with Mark Kuemerle, vice president of technology for Marvell; Letizia Giuliano, vice president for product marketing and management at Alphawave Semi; Hee-Soo Lee, HSD segment lead for Keysight; Mick Posner, senior product group director for Cadence’s Compute Solutions Group; and Rob Kruger, product management director for Synopsys’ multi-die strategy solutions group. What follows are excerpts from a roundtable discussion held at this year’s Design Automation Conference.
To read the full article, click here
Related Chiplet
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
Related News
- AMI Brings Firmware Expertise to Arm Total Design Ecosystem to Simplify and Accelerate Development for Arm-based Custom Chiplet Solutions
- Arm’s Chiplet System Architecture eyes ecosystem sweet spot
- Automotive Chiplet Ecosystem Heralds Agility and Flexibility
- Alphawave Semi Taped-Out Industry Leading 64Gbps UCIe™ IP on TSMC 3nm for the IP Ecosystem, Unleashing Next Generation of AI Chiplet Connectivity
Latest News
- AI Data Centers Push Silicon Photonics Toward 300-mm Scale
- TYLsemi De-Risks Chiplets With New Business Model
- Cadence Introduces AuraStack AI Super Agent, the World’s First Agentic AI Platform for PCB and Advanced Packaging
- Saras Micro Devices Strengthens Senior Leadership Team to Scale Advanced Packaging Technology and Customer Growth
- TYLsemi Raises $43 Million to Launch First Full-Stack Chiplet Platform for Custom AI Silicon