Barriers To Chiplet Sockets
By Brian Bailey, Semiengineering (September 30th, 2024)
Perfection sometimes stands in the way of progress, and there is evidence this may be happening with chiplets. It may be time to slow down and make real progress.
Experts At The Table: Demand for chiplets is growing, but debate continues about whether standards and general-purpose chiplets will kick-start the commercialization boom, or whether success will come through customization of those chiplets. Semiconductor Engineeering sat down these an other related issues with with Elad Alon, CEO of Blue Cheetah; Mark Kuemerle, vice president of technology at Marvell; Kevin Yee, senior director of IP and ecosystem marketing at Samsung; Sailesh Kumar, CEO of Baya Systems; and Tanuja Rao, executive director, business development at Synopsys. What follows are excerpts of that discussion, which was held at the Design Automation Conference. To view part one of this discussion, click here. Part two is here.
Related Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Interconnect Chiplet
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- Optical Chiplet Interconnect Promises to Accelerate Computing Apps
- Arm, ASE, BMW Group, Bosch, Cadence, Siemens, SiliconAuto, Synopsys, Tenstorrent and Valeo commit to join imec’s Automotive Chiplet Program
- Berkeley Lab and Open Compute Project Collaborate to Advance Chiplet Technology for HPC
- Chiplet market to hit US$411B by 2035, transforming semiconductor industry
Latest News
- Cadence Accelerates SoC, 3D-IC and Chiplet Design for AI Data Centers, Automotive and Connectivity in Collaboration with Samsung Foundry
- Synopsys Accelerates AI and Multi-Die Design Innovation on Advanced Samsung Foundry Processes
- Baya Systems to Share Insights on Chiplet Integration, AI Scalability at DAC 2025
- Imec and Tokyo Electron extend partnership to accelerate the development of beyond-2nm nodes
- Multi-Die Assemblies Complicate Parasitic Extraction