What Comes After HBM For Chiplets
By Brian Bailey, SemiEngineering (September 18th, 2024)
The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?
Experts At The Table: Semiconductor Engineering sat down to discuss what will trigger the creation of a commercial chiplet marketplace, and what those chiplet-based designs will look like, with Elad Alon, CEO of Blue Cheetah; Mark Kuemerle, vice president of technology at Marvell; Kevin Yee, senior director of IP and ecosystem marketing at Samsung; Sailesh Kumar, CEO of Baya Systems; and Tanuja Rao, executive director, business development at Synopsys. What follows are excerpts of that discussion, which was held at the Design Automation Conference.
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- What could back an open market for chiplets?
- What are the challenges when testing chiplets?
- What Works Best For Chiplets
- DreamBig Semiconductor Announces Partnership with Samsung Foundry to Launch Chiplets for World Leading MARS Chiplet Platform on 4nm FinFET Process Technology Featuring 3D HBM Integration to Solve Scale-up and Scale-out Limitations of AI for the Masses
Latest News
- Geometry Challenges in Multidie Thermal Management
- SCHMID Announces Successful Delivery and Installation of its InfinityLine C+ System to a Leading Japanese Advanced Packaging Customer
- Marvell to Acquire Celestial AI, Accelerating Scale-up Connectivity for Next-Generation Data Centers
- NGK to Triple Production Capacity for HICERAM Carrier Strengthening Response to the Next-Generation Semiconductor Market
- Neuromorphic Photonic Computing: Lights On