What Comes After HBM For Chiplets
By Brian Bailey, SemiEngineering (September 18th, 2024)
The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?
Experts At The Table: Semiconductor Engineering sat down to discuss what will trigger the creation of a commercial chiplet marketplace, and what those chiplet-based designs will look like, with Elad Alon, CEO of Blue Cheetah; Mark Kuemerle, vice president of technology at Marvell; Kevin Yee, senior director of IP and ecosystem marketing at Samsung; Sailesh Kumar, CEO of Baya Systems; and Tanuja Rao, executive director, business development at Synopsys. What follows are excerpts of that discussion, which was held at the Design Automation Conference.
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- DreamBig Semiconductor Announces Partnership with Samsung Foundry to Launch Chiplets for World Leading MARS Chiplet Platform on 4nm FinFET Process Technology Featuring 3D HBM Integration to Solve Scale-up and Scale-out Limitations of AI for the Masses
- What are the challenges when testing chiplets?
- What Works Best For Chiplets
- EdgeCortix Receives 4 Billion Yen Subsidy from Japan’s NEDO to Advance Energy-Efficient AI Chiplets for Post-5G Communication Systems
Latest News
- Socionext and imec Update Core Partner Program
- TCS Unveils Chiplet-Based System Engineering Services to Accelerate Semiconductor Innovation
- Deca and Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
- Lam Research Introduces VECTOR® TEOS 3D to Address Critical Advanced Packaging Challenges in Chipmaking
- Scintil Photonics Raises $58M to Scale Integrated Photonics for AI Factories