ASIC platform targets automotive chiplets
Alchip Technologies in Taiwan has launched an ASIC and chiplet platform that targets the specialist needs of automotive.
By Nick Flaherty, eeNews Europe (November 23, 2023)
The Automotive platform streamlines the ASIC process for chip, chiplet and module designs but is also of interest to the car makers who have been looking at their own semiconductor design operations following the chip shortages.
Alchip says it is seeing significant interest from companies across Europe, Japan, the United States and Asia. The company has built its reputation as a high-performance ASIC leader through its advanced 2.5D/3DIC design, CoWoS andchiplet design and manufacturing management.
The platform consists of six modules: Design for Autonomous Driving (AD)/ Advanced Driver Assistance System (ADAS), Design for Safety, Design for Test, Design for Reliability, Automotive Chip Sign-off, and Automotive Chip Manufacturing (MFG) Service.
Related Chiplet
- Direct Chiplet Interface
- HBM3e Advanced-packaging chiplet for all workloads
- UCIe AP based 8-bit 170-Gsps Chiplet Transceiver
- UCIe based 8-bit 48-Gsps Transceiver
- UCIe based 12-bit 12-Gsps Transceiver
Related News
- Renesas moves to chiplets for automotive processors
- DreamBig World Leading "MARS" Open Chiplet Platform Enables Scaling of Next Generation Large Language Model (LLM), Generative AI, and Automotive Semiconductor Solutions
- Intel to Acquire Silicon Mobility, Intel Commits to Open Automotive Chiplet Platform
- Axelera plans AI chiplets for automotive
Latest News
- Alphawave Semi Partners with PCISig, CXL Consortium, UCIe Consortium, Samtec and Lessengers to Showcase Advances in AI Connectivity at Supercomputing 2024
- Lightmatter and Amkor Technology Partner to Build World’s Largest 3D Photonics Package
- Lightmatter and ASE Partner to Bring 3D Photonics to Market
- Breaking Boundaries: Chiplet Interconnects, SDVs & electronica 2024
- The Evolution of Interconnects in Microelectronics Packaging