Renesas moves to chiplets for automotive processors
By Steve Bush, ElectronicsWeekly (November 9, 2023)
Renesas will be using chiplets in its next generation of automotive SoCs, and will add software and tool-compatible automotive microcontrollers.
The company revealed this when announcing its 5th generation ‘R-Car’ product range, the first of which will be sampling late next year for cars shipping in 2027.
To read the full article, click here
Related Chiplet
- Optical Chiplet
- Reverse Gearbox Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
Related News
- Axelera plans AI chiplets for automotive
- Why Chiplets Are So Critical In Automotive
- SiPearl looks to automotive chiplets
- Automotive AI: ADAS, Functional Safety and Chiplets
Latest News
- ACM Research Announces Shipment of Its First 310 × 310 mm Ultra ECP ap-p Panel-Level Horizontal Electroplating Production Tool
- Entegris Enters Silicon Carbide and Diamond-Enabled Thermal Management Materials Market for AI Advanced Packaging
- Fraunhofer IPMS Showcases New Technologies for the Future of Semiconductor Industry
- Marvell and Lumentum to Combine, Creating a Category Leader in AI Connectivity
- Silicon Austria Labs Adopts PulseForge Photonic Debonding Technology to Accelerate Advanced Packaging and Heterogeneous Integration Research