Advanced Chip Packaging Tools Are New Battleground in India
By Yashasvini Razdan, EETimes | September 16, 2025
Advanced packaging has become the new battleground in semiconductors. As the industry shifts focus from pursuing smaller transistors to achieving system-level integration, the assembly of bare chips into functional devices becomes crucial.
At SEMICON India 2025, announcements such as the Tata Electronics–Merck MoU for materials and infrastructure, and the Kaynes–Infineon MoU to package Infineon bare die and explore advanced package and MEMS microphone manufacturing in India showed that the country has recognized that packaging is no longer a low-value, outsourced step.
To read the full article, click here
Related Chiplet
- Interconnect Chiplet
- 12nm EURYTION RFK1 - UCIe SP based Ka-Ku Band Chiplet Transceiver
- Bridglets
- Automotive AI Accelerator
- Direct Chiplet Interface
Related News
- SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana
- JCET’s Automotive Chip Advanced Packaging Flagship Factory Project Gains Momentum
- Advanced packaging blurs line between monolithic chip and packaged assembly of heterogeneous chips: NAPMP NoI
- Biden-Harris Administration Announces CHIPS Incentives Awards with Absolics and Entegris to Support Development of Advanced Packaging Technology and Onshore Materials for Leading-Edge Chip Production
Latest News
- Geometry Challenges in Multidie Thermal Management
- SCHMID Announces Successful Delivery and Installation of its InfinityLine C+ System to a Leading Japanese Advanced Packaging Customer
- Marvell to Acquire Celestial AI, Accelerating Scale-up Connectivity for Next-Generation Data Centers
- NGK to Triple Production Capacity for HICERAM Carrier Strengthening Response to the Next-Generation Semiconductor Market
- Neuromorphic Photonic Computing: Lights On