GSCM 2024: Interview with A.M. Fitzgerald and Associates' Alissa Fitzgerald
In this interview, Nitin Dahad sat down with Alissa Fitzgerald to talk about through-silicon vias, chiplets, 3D-ICs, and how these "new" technologies originated from MEMS technologies developed decades ago.
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related Videos
- Live with Cadence talking AI, Chiplets, Virtual Prototyping and more at Embedded World 2024
- Electronica 2024 - Shaping the Future of Automotive Electronics with Chiplets and Sustainability
Latest Videos
- Standardizing System-Level Interoperability for Multi-Vendor Chiplets
- Towards wafer-scale optical interconnect relying on Silicon Photonics and advanced 3D assembly
- Pre-Silicon Chiplet Verification for Datacenters
- Chiplets Modularity for AI and HPC
- Athos Silicon mSoC™ | A New Compute Architecture for Physical AI