GSCM 2024: Interview with A.M. Fitzgerald and Associates' Alissa Fitzgerald
In this interview, Nitin Dahad sat down with Alissa Fitzgerald to talk about through-silicon vias, chiplets, 3D-ICs, and how these "new" technologies originated from MEMS technologies developed decades ago.
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related Videos
- Live with Cadence talking AI, Chiplets, Virtual Prototyping and more at Embedded World 2024
- Electronica 2024 - Shaping the Future of Automotive Electronics with Chiplets and Sustainability
Latest Videos
- 2026 Predictions from Alpahwave Semi, now part of Qualcomm
- Arm Viewpoints: Chiplets explained – the technology and economics behind the next wave of silicon innovation
- The State of Multi-Die: Insights and Customer Requirements
- Coding approaches for increasing reliability and energy efficiency of 3D technologies
- AI-Driven Thermal Prediction for Enhanced Reliability in 3D HBM Chiplets