Where Will Chiplets Head in 2025?

High-performance computing needs expected to drive growth of multi-die packages, particularly 3D.

By Spencer Chin, DesignNews (January 17, 2025)

For the past few years, chiplets have held the promise of giving design engineers the flexibility to package multiple chips and handle diverse technologies, but issues such as standards, production infrastructure, and testing have been obstacles. One industry insider believes there will be measurable progress this year resolving these issues, particularly as the high-perfomance computing needs dictate more robust, flexible packaging solutions than traditional monolithic system-on-chip approaches.

In an interview with Design News, Michael Posner, Vice President of Product Management at Synopsys, predicts that as much as half of the new applications in high-performance computing will involve multi-die designs, which include chiplets.

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