Glass, chiplets will propel advanced IC substrate market, says Yole
By Peter Clarke, eeNews Europe (September 9, 2024)
The advanced IC substrate market is set to be worth US16.6 billion in 2024 and enjoy a compound annual growth rate (CAGR) of 9 percent over the period 2024 to 2029, according to Yole Group.
The competition to commercialize glass-cored substrates – which resist warping under heat – is intensifying as more players enter the field, the analyst said. Yole lists startup Absolics, Intel and Samsung among the key players.
The growth that is forecast will be driven by rising demand for flip-chip ball grid array substrates and 2.5D/3D advanced packages. This demand is across a broad front including high-performance computing and data centers, 5G, CPUs and XPUs for AI personal computers and automotive sectors.
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