Three-Way Race To 3D-ICs
Intel, TSMC, and Samsung are developing a broad set of technologies and relationships that will be required for the next generation of AI chips.
By Ed Sperling, Semi Engineering | May 5th, 2025
Intel Foundry, TSMC, and Samsung Foundry are scrambling to deliver all the foundational components of full 3D-ICs, which collectively will deliver orders of magnitude improvements in performance with minimal power sometime within the next few years.
Much attention has been focused on process node advances, but a successful 3D-IC implementation is much more complex and comprehensive than just scaling digital logic. It requires new materials, and different ways of handling thinner substrates and putting them together.
To read the full article, click here
Related Chiplet
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
Related News
- Why There Are Still No Commercial 3D-ICs
- The Race To Glass Substrates
- Executive Outlook: Chiplets, 3D-ICs, and AI
- NcodiN Secures €16M Seed Round to Break AI’s Main Bottleneck with the World’s Smallest Laser
Latest News
- Point2 Completes $136M Series B Funding with Arm, LB Investment, and Maverick Silicon
- Multibeam Appoints Interim CFO Following $200M Funding Milestone
- Multibeam Signs $140 Million Letter of Intent with the U.S. Department of Commerce
- Credo to Contribute OmniConnect Scale-In Interconnect Solution to the Open Compute Project to Address AI Inference Memory Wall
- Silicon Box Ships 500M Units at High Yield, Expands Production Capacity for Panel-Level Packaging