Three-Way Race To 3D-ICs
Intel, TSMC, and Samsung are developing a broad set of technologies and relationships that will be required for the next generation of AI chips.
By Ed Sperling, Semi Engineering | May 5th, 2025
Intel Foundry, TSMC, and Samsung Foundry are scrambling to deliver all the foundational components of full 3D-ICs, which collectively will deliver orders of magnitude improvements in performance with minimal power sometime within the next few years.
Much attention has been focused on process node advances, but a successful 3D-IC implementation is much more complex and comprehensive than just scaling digital logic. It requires new materials, and different ways of handling thinner substrates and putting them together.
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