Executive Outlook: Chiplets, 3D-ICs, and AI
Trouble spots, and some solutions, for the next wave of high-performance semiconductors.
By Ed Sperling, Semi Engineering | May 29, 2025
Semiconductor Engineering sat down to discuss chiplets and the challenges of moving to 3D-ICs with Bill Mullen, Ansys fellow; John Ferguson, senior director of product management at Siemens EDA; Chris Mueth, senior director of new markets and strategic initiatives at Keysight; Albert Zeng, senior engineering group director at Cadence; Anand Thiruvengadam, senior director and head of AI product management at Synopsys. What follows are excerpts of that discussion, which was held in front of a live audience at ESD Alliance 2025.
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