Thinking Big: From Chips To Systems
By Ed Sperling, Semiconductor Engineering (February 27, 2024 )
Multi-die systems require new tools, technologies, and some very different approaches to design automation.
Semiconductor Engineering sat down with Aart de Geus, executive chair and founder of Synopsys, to talk about the shift from chips to systems, next-generation transistors, and what’s required to build multi-die devices in the context of rapid change and other systems.
To read the full article, click here
Related Chiplet
- Optical Chiplet
- Reverse Gearbox Chiplet
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- Ncore Multi-Die Interconnect IP
- Integrated voltage regulator (IVR) chiplet
Related News
- Applied Materials Introduces New Systems to Accelerate DRAM and Advanced Packaging for AI Chips
- Biden-Harris Administration Announces Over $5 Billion from the CHIPS and Science Act for Research, Development, and Workforce
- EdgeCortix Receives 4 Billion Yen Subsidy from Japan’s NEDO to Advance Energy-Efficient AI Chiplets for Post-5G Communication Systems
- Baya Systems Celebrates First Year of Hypergrowth After Emerging from Stealth
Latest News
- Amkor Technology and NVIDIA Advance Strategic Partnership for AI Infrastructure
- Siemens expands agentic AI collaboration to tackle 3D IC power and thermal challenges with NVIDIA
- Photon Bridge Raises €10M to Tackle AI’s Emerging Laser Bottleneck
- Abacus Semiconductor and Aalto University Announce Research Cooperation on High-Speed Chiplet Interconnects
- UK Launches Semiconductor Catapult to Strengthen Sovereign Capabilities in AI Hardware and Defence