Thinking Big: From Chips To Systems
By Ed Sperling, Semiconductor Engineering (February 27, 2024 )
Multi-die systems require new tools, technologies, and some very different approaches to design automation.
Semiconductor Engineering sat down with Aart de Geus, executive chair and founder of Synopsys, to talk about the shift from chips to systems, next-generation transistors, and what’s required to build multi-die devices in the context of rapid change and other systems.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- AI Chips Shifting from Round to Rectangular
- Eliyan Secures $50 Million in Strategic Investments from Leading Hyperscalers and AI Infrastructure Providers to Accelerate Scalable AI Systems
- Biden-Harris Administration Announces Over $5 Billion from the CHIPS and Science Act for Research, Development, and Workforce
- EdgeCortix Receives 4 Billion Yen Subsidy from Japan’s NEDO to Advance Energy-Efficient AI Chiplets for Post-5G Communication Systems
Latest News
- Baya Systems Strengthens Engineering Leadership to Accelerate Chiplet Implementation
- Onto Innovation’s Dragonfly® G5 System Qualified for Applications in 2.5D AI Packaging
- Indium Corporation Presents Collaborative Research on Solder Alloy Reliability for Heterogeneous Integration at ICEP-HBS
- Silicon Box Announces It Joins Imec Automotive Chiplet Program to Strengthen Chip Supply Chains for Next-Generation Vehicles
- EdgeCortix Announces New Investment from Axiro Semiconductor and MPower Partners to Advance Next-Generation Edge AI Platforms