Testing For Thermal Issues Becomes More Difficult

By Gregory Haley, SemiEngineering (December 10, 2024)

Chiplets, exotic materials, and heterogeneous integration are impacting test coverage.

In the past, thermal effects were largely an afterthought for test engineers. Devices operating at higher frequencies or employing materials like silicon-germanium (SiGe), gallium nitride (GaN), or silicon carbide (SiC) have distinct thermal behaviors at the chip level. That’s not the case for heterogeneous stacks of chiplets. In fact, each chiplet may have different power and thermal characteristics.

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