Report: SK Hynix mulls offering advance packaging foundry service
By Peter Clarke, eeNews Europe ( December 16, 2024)
Memory chip vendor SK Hynix is considering a move into 2.5D chip packaging as a foundry outsource operation, according to South Korea’s ETnews.
The move may be partially driven by SK Hynix’s sub-ordinate role to foundry TSMC in the creation of AI accelerators for Nvidia. If SK Hynix could offer 2.5D packaging skills it could potentially offer to work in parallel with TSMC and perform the integration of GPU die and high-bandwidth memory (HBM) DRAM components in AI acceleration components.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana
- SK hynix Signs Preliminary Memorandum of Terms with U.S. Department of Commerce for Advanced Packaging Facility in Indiana
- 2.5D/3D chip technology to advance semiconductor packaging
- 2.5D Integration: Big Chip Or Small PCB?
Latest News
- Imec unlocks system-level III-V chiplet integration on Si-CMOS by advancing its 300mm RF silicon interposer platform with high-density MIMCAPs, passive modeling, and laser-assisted bonding
- CoAsia SEMI Unveils Advanced Strategy for Next-Generation Chiplet Platform 'CoCs™' at Samsung SAFE Forum
- JCET Launches Next-Generation Power Module Packaging and Test Solutions for AI Data Centers
- As Chips Go Vertical, Metrology Struggles to Keep Up
- Silicon Box Secures SGD 100M Financing to Accelerate Growth in Advanced Packaging