Report: SK Hynix mulls offering advance packaging foundry service
By Peter Clarke, eeNews Europe ( December 16, 2024)
Memory chip vendor SK Hynix is considering a move into 2.5D chip packaging as a foundry outsource operation, according to South Korea’s ETnews.
The move may be partially driven by SK Hynix’s sub-ordinate role to foundry TSMC in the creation of AI accelerators for Nvidia. If SK Hynix could offer 2.5D packaging skills it could potentially offer to work in parallel with TSMC and perform the integration of GPU die and high-bandwidth memory (HBM) DRAM components in AI acceleration components.
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