NTT looks to 15Tbit/s chiplet optical interconnects
NTT in Japan has set up a subsidiary to develop a short range 15Tbit/s optical transceiver for chiplet interconnects.

By Nick Flaherty, eeNews Europe (March 18, 2024)
The co-packaged optical and electronic technologies being developed by NTT Innovative Devices (ID) are aimed at combining photonic and electronic hardware in the data centre and in devices, including smartphones.
The roadmap for the Innovative Optical and Wireless Network (IOWN) initiative, NTT’s next-generation communications and computing infrastructure, has three elements: an all-photonics network, digital twin computing and the Cognitive Foundation.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- How can in-package optical interconnects enhance chiplet generative AI performance?
- How does UCIe on chiplets enable optical interconnects in data centers?
- Ayar Labs Unveils World's First UCIe Optical Chiplet for AI Scale-Up Architectures
- Alphawave Semi at the Forefront of PCIe® 7.0 Specification: Showcasing Next-Gen Chiplet Interoperability and Optical PCIe Technology at PCI-SIG® Developers Conference 2025
Latest News
- Imec unlocks system-level III-V chiplet integration on Si-CMOS by advancing its 300mm RF silicon interposer platform with high-density MIMCAPs, passive modeling, and laser-assisted bonding
- CoAsia SEMI Unveils Advanced Strategy for Next-Generation Chiplet Platform 'CoCs™' at Samsung SAFE Forum
- JCET Launches Next-Generation Power Module Packaging and Test Solutions for AI Data Centers
- As Chips Go Vertical, Metrology Struggles to Keep Up
- Silicon Box Secures SGD 100M Financing to Accelerate Growth in Advanced Packaging