NTT looks to 15Tbit/s chiplet optical interconnects
NTT in Japan has set up a subsidiary to develop a short range 15Tbit/s optical transceiver for chiplet interconnects.
By Nick Flaherty, eeNews Europe (March 18, 2024)
The co-packaged optical and electronic technologies being developed by NTT Innovative Devices (ID) are aimed at combining photonic and electronic hardware in the data centre and in devices, including smartphones.
The roadmap for the Innovative Optical and Wireless Network (IOWN) initiative, NTT’s next-generation communications and computing infrastructure, has three elements: an all-photonics network, digital twin computing and the Cognitive Foundation.
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- How can in-package optical interconnects enhance chiplet generative AI performance?
- How does UCIe on chiplets enable optical interconnects in data centers?
- Chiplet Interconnects Add Power And Signal Integrity Issues
- Ayar Labs Unveils World's First UCIe Optical Chiplet for AI Scale-Up Architectures
Latest News
- NIST Researchers Develop Photonic Chip Packaging That Can Withstand Extreme Environments
- Rebellions Closes $400 Million Pre-IPO and Launches RebelRack™ and RebelPOD™ to Accelerate Global Expansion
- EdgeCortix Looks To Chiplets For Third-Gen Reconfigurable AI Chip
- Agileo Automation Launches Agil'EDA to Accelerate SEMI EDA Adoption for Semiconductor Equipment OEMs
- AEM and ASE Enter Strategic Partnership to Accelerate AI and HPC Test Innovation