NTT looks to 15Tbit/s chiplet optical interconnects
NTT in Japan has set up a subsidiary to develop a short range 15Tbit/s optical transceiver for chiplet interconnects.
By Nick Flaherty, eeNews Europe (March 18, 2024)
The co-packaged optical and electronic technologies being developed by NTT Innovative Devices (ID) are aimed at combining photonic and electronic hardware in the data centre and in devices, including smartphones.
The roadmap for the Innovative Optical and Wireless Network (IOWN) initiative, NTT’s next-generation communications and computing infrastructure, has three elements: an all-photonics network, digital twin computing and the Cognitive Foundation.
To read the full article, click here
Related Chiplet
- Integrated voltage regulator (IVR) chiplet
- High-performance connectivity chiplets
- eFPGA Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
Related News
- How can in-package optical interconnects enhance chiplet generative AI performance?
- How does UCIe on chiplets enable optical interconnects in data centers?
- Ayar Labs Unveils World's First UCIe Optical Chiplet for AI Scale-Up Architectures
- Alphawave Semi at the Forefront of PCIe® 7.0 Specification: Showcasing Next-Gen Chiplet Interoperability and Optical PCIe Technology at PCI-SIG® Developers Conference 2025
Latest News
- proteanTecs Unveils Advanced Packaging Solutions to Improve Yield, Performance, and Reliability of Multi-Die Systems
- JCET Advances High-Aspect-Ratio TSV Technology for 2.5D and 3D Packaging
- Semiconductor Research Corporation Launches SPARC, Accelerating Industry-Driven University Research for the Next Generation of Semiconductor Innovation
- The world’s first technology 'Silicon Motherboard' Circuits are formed on both sides of the silicon substrate, reducing mounting footprint by 80%
- Avicena Ships World's First 1Tbps Evaluation Kits, Extending Its Leadership in microLED Optical Interconnects