How AI Will Define the Next Silicon Supercycle
By Kevork Kechichian, EVP, Solutions Engineering, Arm
EETimes | March 10, 2025

Silicon technologies define the billions of devices we use today, as well as powering solutions in the data center and cloud that are vital for processing in the age of AI. However, with the meteoric rise of AI creating yet more demand for compute and ongoing push for smaller processing nodes, the cost and complexity of chips continue to rise at an unprecedented rate.
In fact, according to McKinsey estimates, the total generative AI compute demand could reach 25×1030 FLOPs by 2030, which vastly exceeds the performance of current supercomputers and AI systems. Therefore, efficient AI processing through silicon remains a core consideration for the industry.
As a result, the semiconductor industry currently sits at an inflection point that will ultimately require a transformation in silicon design, development and deployment. The next big silicon supercycle will unleash life-changing innovation and decades of unprecedented engineering creativity.
Here are my seven predictions for how this will happen:
To read the full article, click here
Related Chiplet
- DPIQ Tx PICs
- IMDD Tx PICs
- Near-Packaged Optics (NPO) Chiplet Solution
- High Performance Droplet
- Interconnect Chiplet
Related News
- Breaking the Memory Wall: How d-Matrix Is Redefining AI Inference with Chiplets
- Alphawave Semi Highlights Why the Next Generation of AI Advances Demand Chiplet Architectures at EE Times: The Future of Chiplets
- Alphawave Semi Taped-Out Industry Leading 64Gbps UCIe™ IP on TSMC 3nm for the IP Ecosystem, Unleashing Next Generation of AI Chiplet Connectivity
- Rebellions Raises $250 Million to Advance the Next Generation AI Infrastructure, Backed by Arm and Samsung
Latest News
- Xanadu and Tower Semiconductor Deepen Strategic Collaboration to Accelerate Photonic Quantum Hardware Innovation
- EV Group Unveils Next-Generation EVG®120 Resist Processing System for High-Volume Manufacturing
- CEA Demonstrates First Dynamically Routed Electro-Optical Router for Photonic Interposers
- Renesas Develops SoC Technologies for Automotive Multi-Domain ECUs Essential for the SDV Era
- Keysight Unveils 3D Interconnect Designer for Chiplet and 3DIC Advanced Package Designs